MetPET is a project supported/ funded by the European Space Agency (ESA) under the Technology Development Element (TDE) programme (Contract No. 4000151463/26/NL/VR/mmo). The objective of the activity is to develop metallised PET film capacitors in SMD format, specifically designed for space applications, with high capacitance and energy density, and capable of withstanding high-temperature assembly stresses resulting from the lead-free soldering transition.
Currently, metallised PET film capacitors are primarily used in space for filtering purposes and power electronics due to their low dielectric losses, stable characteristics and the ability of cover power constraints with lower capacitance values compared with other capacitor families. However, owing to the current lead-free transition, there are not capacitors of this family that are able to withstand the high temperatures induced by the lead-free soldering. Thus, there is a need to develop an innovative solution of metallised polyester film capacitors, in Surface Mounted Device (SMD) package in order to ease the integration, with an improved internal design to endure high-temperature lead-free soldering, with high capacitance and enhanced energy density.
CIDETEC’S role in the project:
CIDETEC Surface Engineering is the coordinator of the project and leader of one WP. CIDETEC will deposit a low-phosphorus nickel (Ni-P) coating, with a thickness on the order of 20–100 nm, onto a polyester film thinner than 20 µm. This coating aims to enhance thermal resistance required for the transition to lead-free soldering. Furthermore, the coating, in combination with the developed design of the capacitor, must guarantee the project objectives: achieving a high-capacitance, high-energy-density capacitor. The metallised PET samples will be characterized to evaluate critical properties, including adhesion, coating thickness, and surface morphology. Electrical characterization will be performed using the four-point probe method to measure the sheet resistance of the nickel coating and ensure uniform conductivity.